Wetting Behavior of Molten Ag Nanodroplet on the Cu Substrate

Goli, M.; Davoodi, J.

Please use this identifier to cite or link to this item: http://essuir.sumdu.edu.ua/handle/123456789/35330

Or use following links to share this resource in social networks: Recommend this item

Title	Wetting Behavior of Molten Ag Nanodroplet on the Cu Substrate
Authors	Goli, M. Davoodi, J.
ORCID
Keywords	Ag Nanodroplet Spreading Molecular Dynamics Simulation Cu Substrate
Type	Conference Papers
Date of Issue	2013
URI	http://essuir.sumdu.edu.ua/handle/123456789/35330
Publisher	Sumy State University
License	Copyright not evaluated
Citation	Goli, M. Wetting Behavior of Molten Ag Nanodroplet on the Cu Substrate [Текст] / M. Goli, J. Davoodi // Nanomaterials: Applications & Properties (NAP-2013) : 2-nd International conference, Alushta, the Crimea, September 17-22, 2012 / Edited by: A. Pogrebnjak. - Sumy : Sumy State University, 2013. - V.2, No1. - 01PCSI31
Abstract	The main objective of this investigation was to study spreading of Silver (Ag) nanodroplet on the Cooper (Cu) surface by molecular dynamics (MD) simulation method. The quantum Sutton-Chen (Q-SC) many body potential was used to calculate cohesive energy as well as force experienced by every atoms. The temperature and pressure of nanodroplet were controlled by Nose-Hoover thermostat and Berendsen barostat respectively. The effect of nanodroplet size on the wetting and contact angle of silver nanodroplet on a copper solid surface was calculated by changing the number of atoms within the nanodroplet. By varying the cooling rate during spreading of nanodroplet, it was found that decreasing the cooling rate decreases the contact angle of nanodroplet, and it spreads better on the copper surface. Also, increasing initial temperature of nanodroplet decreased the contact angle. When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/35330
Appears in Collections:	Наукові видання (ЕлІТ)