The Design of a Low Power MEMS Based Micro-hotplate Device Using a Novel Nickel Alloy for Gas Sensing Applications

Abstract

In this paper comparative analysis of MEMS (Micro-electro-mechanical System) based Micro-hotplate using three different heating elements use as separately are presented. Three different materials (viz. DilverP1, Polysilicon, and Platinum) are used as heating elements with same thickness of 0.2 m. Coventor- WareTM simulator has been used for construction of 3D model and electro-thermo-mechanical analysis of Micro-hotplate device. Power consumption, stress and displacement of Micro-hotplate are studied at operating temperature (165 ºC). It is obtained that power consumption, stress and displacement of Dilverp1 heating element are 13.06 mW, 190 MPa and 0.028 m which are less in comparison to those with Poly Silicon heater and Platinum heater at moderate temperature (150-200 C) over the sensing material (ZnO). When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/35816