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Title | Instantaneous Fabrication of Thin MEMS Features by Copper Electrodeposition Using Modified Inkjet Printer |
Authors |
Deshmukh, Vimal Kumar
Namdev, Ankit Narang, H.K. Rajput, M.S. Pandey, P.M. |
ORCID | |
Keywords |
MEMS electrodeposition copper inkjet thin metallic coating |
Type | Article |
Date of Issue | 2020 |
URI | https://essuir.sumdu.edu.ua/handle/123456789/77408 |
Publisher | Sumy State University |
License | |
Citation | Instantaneous Fabrication of Thin MEMS Features by Copper Electrodeposition Using Modified Inkjet Printer [Текст] / Vimal Kumar Deshmukh, Ankit Namdev, H.K. Narang [et al.] // Журнал нано- та електронної фізики. – 2020. – Т. 12, № 2. – 02044. – DOI: 10.21272/jnep.12(2).02044. |
Abstract |
Microelectromechanical system (MEMS) has been used so far in today’s scenario in mechatronic assemblies to enhance its functionality and mitigate the complexity of design. Micro electrodeposition technique enables to produce such features. This research is an attempt to fabricate the micro feature instantaneously using a modified ink jet printer on an aluminium substrate. The acidic electrolyte was prepared by using Cupric Sulphate Penta hydrate (CuSO4.5H2O) of 1M concentration with H2SO4. Multiple passes
deposit the copper ion on Aluminium sheet with thickness of 0.2 mm. the feature design, Voltage and concentration of electrolyte has been taken as Input parameter. Surface characteristics have been discussed in this article. Result revealed thin metallic sheet can only be used for 6-7 passes due to wrinkles and edge deformation. If more passes will be carried out on an aluminium foil sheet then uniform deposition of copper metal ions will be possible. The concentration of CuSO4.5H2O has played important role in this experimental process on deposition rate. |
Appears in Collections: |
Журнал нано- та електронної фізики (Journal of nano- and electronic physics) |
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Vimal_Kumar_Deshmukh_JNEP_2_2020.pdf | 349.82 kB | Adobe PDF | 243119296 |
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