Experimental Test of a Three-Dimensional Model for Electrophysical Properties of Metal Films

Abstract

A three-dimensional model of strain sensitivity proposed by [Tellier, Tosser: Thin Solid Films 59 (1979) 163; Tosser, Tellier and Pichard: J. Mater. Sci. 16 (1981) 944] has been tested for thin Cr, Cu and Co films. The films were obtained by electron-beam evaporation in a vacuum of 10-4 – 10-5 Pa. Film structure stabilization was carried out by heating and cooling at the rate of 3 K/min in the range of 300 to 520 K. The identity of properties of the films obtained on the glass (during the thermal coefficient of resistance (TCR) measuring) and the textolite glass (during the strain-sensitivity coefficient (SSC) measuring) substrates was examined according to Vand method on lattice distortion energy spectra for films of different thickness, where the spectra were calculated from the resistance-temperature data. It has been shown that the experimental results of the strain sensitivity agree with the calculated ones only under the assumption of size dependence of the electron mean-free path. When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/846