Please use this identifier to cite or link to this item: http://essuir.sumdu.edu.ua/handle/123456789/43228
Or use following links to share this resource in social networks: Recommend this item
Title Application of Ultrasonic Bonding in Leds and Led Lamps Production
Authors Afonin, K.N.
Ryapolova, Y.V.
Soldatkin, V.S.
Tuev, V.I.
Keywords Nitride chip
Current-voltage characteristic of the LED
Ultrasonic microwelding
Planning eksperiment
Type Article
Date of Issue 2015
URI http://essuir.sumdu.edu.ua/handle/123456789/43228
Publisher Sumy State University
License
Citation Afonin, K.N. Application of Ultrasonic Bonding in Leds and Led Lamps Production [Текст] / K.N. Afonin, Y.V. Ryapolova, V.S. Soldatkin et al. // Журнал нано- та електронної фізики. — 2015. — Т.7, №4. — 04029-1.
Abstract This article presents the results of studies of the effect ultrasonic bonding on the current-voltage characteristic nitrides chips with using methods of planning the experiment.
Appears in Collections: Журнал нано- та електронної фізики (Journal of nano- and electronic physics)

Views

Bangladesh Bangladesh
1
Canada Canada
1007
Czechia Czechia
1
France France
2
Germany Germany
3
Italy Italy
1
Japan Japan
4
Russia Russia
3
Ukraine Ukraine
232
United Kingdom United Kingdom
2015
United States United States
749
Unknown Country Unknown Country
9

Downloads

China China
10
Germany Germany
3
Greece Greece
2
Japan Japan
2
Russia Russia
1
South Korea South Korea
1
Ukraine Ukraine
207
United Kingdom United Kingdom
1
United States United States
1008
Unknown Country Unknown Country
6

Files

File Size Format Downloads
jnep_2015_V7_04029.pdf 201,92 kB Adobe PDF 1241

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.