In situ stress evolution during growth of transition metal nitride films and nanocomposites

Abstract

The issue of stress evolution during growth of hard transition metal nitride (TMN) based coatings is of vital importance to understand origin of intrinsic stress development and to control stress level in order to avoid mechanical failure of coated components and devices. By using in situ and real-time wafer curvature measurements based on a multiple- beam optical stress sensor (MOSS), basic insights on the atomistic mechanisms at the origin of stress development and stress relaxation can be obtained. In the present paper, a review of recent advances on stress development during reactive magnetron sputter-deposition of binary TMN films (TiN, ZrN, TaN) as wells as ternary systems (TiZrN, TiTaN) will be presented. The influence of growth energetics on the build-up of compressive stress will be addressed. A correlation between stress, texture and film morphology is demonstrated. Finally, illustration will be given for quaternary TiZrAlN nanocomposites. When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/20742