Please use this identifier to cite or link to this item: http://essuir.sumdu.edu.ua/handle/123456789/37125
Or use following links to share this resource in social networks: Recommend this item
Title Intrinsic Stress Formation at Plasma-Ion Deposition of TiN Coatings in Pulse Potential Mode
Authors Kalinichenko, A.I
Kozionov, S.A.
Perepelkin, S.S.
Strel’nitskij, V.E.
ORCID
Keywords TiN coating
Plasma-based ion deposition
Pulse potential mode deposition
Intrinsic stress
Non-local thermoelastic peak of ion
Type Article
Date of Issue 2014
URI http://essuir.sumdu.edu.ua/handle/123456789/37125
Publisher Sumy State University
License
Citation Proc. NAP 3, 01PCSI15 (2014)
Abstract Formula for intrinsic stress calculation in coatings deposited from ion flux in the pulse potential mode is derived. The case of deposition of ions with different charges is taken into account. The criterion of applicability of derived formula is proposed which permits determining critical parameters of the pulse potential mode. Calculation of stress in TiN coatings at deposition of low-energy ions Ti+ from filtered vacuum arc plasma is brought. The qualitative agreement of calculated stresses with experimental data is stated. The important role of deposition temperature for intrinsic stress control in deposited coating is noted.
Appears in Collections: Наукові видання (ЕлІТ)

Views

Canada Canada
1
Germany Germany
1690206
Ireland Ireland
29862342
Lithuania Lithuania
1
Netherlands Netherlands
2549
Singapore Singapore
113398612
Ukraine Ukraine
14931537
United Kingdom United Kingdom
7470865
United States United States
226797224
Unknown Country Unknown Country
108
Vietnam Vietnam
28878

Downloads

China China
68
Germany Germany
2
Ireland Ireland
1
Lithuania Lithuania
1
Ukraine Ukraine
14931538
United Kingdom United Kingdom
1
United States United States
113398611
Unknown Country Unknown Country
21
Vietnam Vietnam
1

Files

File Size Format Downloads
Kalinichenko_Kozionov_Perepelkin_Strel’nitskij.pdf 519,98 kB Adobe PDF 128330244

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.