Please use this identifier to cite or link to this item:
http://essuir.sumdu.edu.ua/handle/123456789/29599
Or use following links to share this resource in social networks:
Tweet
Recommend this item
Title | Sol-Gel Deposited Porogen Based Porous Low-k Thin Films for Interlayer Dielectric Application in ULSI Circuits |
Authors |
Mhaisagar, Y.S.
Mahajan, A.M. |
ORCID | |
Keywords |
Sol-gel Tween80 Porosity FT-IR Low-k |
Type | Article |
Date of Issue | 2012 |
URI | http://essuir.sumdu.edu.ua/handle/123456789/29599 |
Publisher | Сумський державний університет |
License | |
Citation | Yogesh S. Mhaisagar, A.M. Mahajan, J. Nano- Electron. Phys. 4 No 3, 03002 (2012) |
Abstract |
Porous SiO2 low-k thin films with low dielectric constant were successfully deposited by sol-gel spin-coating technique. The films were deposited by using Tertaethylorthosilicate (TEOS) as a precursor solution and HF was used as an acid catalyst solution. The Tween80 with different volumetric concentrations i.e. 0.0 ml, 0.5 ml and 0.7 ml was used as a pore generator to lower the dielectric constant of the films by introducing the porosity in the films matrix. The thickness and refractive index (RI) of low-k thin films have been measured by Ellipsometer. The refractive index and thickness of the films observed to be decreasing with increase in Tween80 concentration. The chemical bonding structures of films were analyzed by using Fourier transform infrared spectroscopy (FT-IR) spectroscopy and the stretching, bending and rocking peaks appear at 1077 cm – 1, 967 cm – 1, 447 cm – 1 respectively confirm the formation of Si-O-Si network. The RIs of the films deposited at 0 ml, 0.5 ml and at 0.7 ml of Tween80 concentration are found to be 1.34, 1.26, and 1.20 respectively. Based on RI values of the films, the porosity percentage, density and dielectric constant have been calculated by standard formulation method. The increase in porosity percentage of films from 3 % to 55 % with increase in Tween80 concentration reveals that, the most of the hydroxyl group and porogen get evaporated and form more voids in the films. This increase in porosity percentage causes to lower the dielectric constant of films and was found to be 2.26 at the 0.7 ml of Tween80 concentration. Such porogen based low dialectic constant thin films can be suitable for interlayer dielectric (ILD) applications in ULSI circuits.
When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/29599 |
Appears in Collections: |
Журнал нано- та електронної фізики (Journal of nano- and electronic physics) |
Views
![Argentina](/flags/ar.gif)
1
![Canada](/flags/ca.gif)
3
![China](/flags/cn.gif)
11
![EU](/flags/eu.gif)
1
![Finland](/flags/fi.gif)
1
![Germany](/flags/de.gif)
4920762
![India](/flags/in.gif)
7
![Iran](/flags/ir.gif)
1
![Ireland](/flags/ie.gif)
651809
![Japan](/flags/jp.gif)
2
![Lithuania](/flags/lt.gif)
1
![Malaysia](/flags/my.gif)
1
![Netherlands](/flags/nl.gif)
1
![Russia](/flags/ru.gif)
17
![Singapore](/flags/sg.gif)
1
![Slovakia](/flags/sk.gif)
1
![South Korea](/flags/kr.gif)
3
![Turkey](/flags/tr.gif)
6
![Ukraine](/flags/ua.gif)
40766088
![United Kingdom](/flags/gb.gif)
20388391
![United States](/flags/us.gif)
413273973
![Unknown Country](/flags/--.gif)
90
![Vietnam](/flags/vn.gif)
42700
Downloads
![China](/flags/cn.gif)
279734171
![Germany](/flags/de.gif)
5
![India](/flags/in.gif)
12654575
![Japan](/flags/jp.gif)
1
![Lithuania](/flags/lt.gif)
1
![Mexico](/flags/mx.gif)
1
![Taiwan](/flags/tw.gif)
1
![Ukraine](/flags/ua.gif)
79424473
![United Kingdom](/flags/gb.gif)
1
![United States](/flags/us.gif)
346504070
![Unknown Country](/flags/--.gif)
139
![Vietnam](/flags/vn.gif)
1
Files
File | Size | Format | Downloads |
---|---|---|---|
Mhaisagar.pdf | 309,76 kB | Adobe PDF | 718317439 |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.