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Title Ultralow Thermal Conductivity and Thermal Stress of Ceramics with Surface Nanowire-structures
Authors Liang, L.H.
Wei, Y.G.
Keywords Nanowires
Thermal conductivity
Elastic modulus
Thermal stress
Type Conference Papers
Date of Issue 2012
URI http://essuir.sumdu.edu.ua/handle/123456789/34880
Publisher Sumy State University
License
Citation Liang, Yu. Ultralow Thermal Conductivity and Thermal Stress of Ceramics with Surface Nanowire-structures / L. Liang, Y. Wei // Nanomaterials: Applications & Properties (NAP-2012) : 2-nd International conference, Alushta, the Crimea, September 17-22, 2012 / Edited by: A. Pogrebnjak. - Sumy : Sumy State University, 2012. - V. 1, No2. - 02NFC15-02NFC15
Abstract An analytical model on the size and fraction dependent thermal conductivity, elastic modulus and thermal stress of nanowire-composites are developed, and the theoretical prediction agrees with the experimental results of Si nanowires. And the model proposes that the high thermal shock strength of ceramics can be achieved by surface nanostructurization, which is related to the low thermal conductivity and thermal stress of the nanostructures and voids. The theory will be helpful to guide design of thermal barrier coatings. When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/34880
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