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Title | Wetting Behavior of Molten Ag Nanodroplet on the Cu Substrate |
Authors |
Goli, M.
Davoodi, J. |
ORCID | |
Keywords |
Ag Nanodroplet Spreading Molecular Dynamics Simulation Cu Substrate |
Type | Conference Papers |
Date of Issue | 2013 |
URI | http://essuir.sumdu.edu.ua/handle/123456789/35330 |
Publisher | Sumy State University |
License | |
Citation | Goli, M. Wetting Behavior of Molten Ag Nanodroplet on the Cu Substrate [Текст] / M. Goli, J. Davoodi // Nanomaterials: Applications & Properties (NAP-2013) : 2-nd International conference, Alushta, the Crimea, September 17-22, 2012 / Edited by: A. Pogrebnjak. - Sumy : Sumy State University, 2013. - V.2, No1. - 01PCSI31 |
Abstract |
The main objective of this investigation was to study spreading of Silver (Ag) nanodroplet on the
Cooper (Cu) surface by molecular dynamics (MD) simulation method. The quantum Sutton-Chen (Q-SC)
many body potential was used to calculate cohesive energy as well as force experienced by every atoms.
The temperature and pressure of nanodroplet were controlled by Nose-Hoover thermostat and Berendsen
barostat respectively. The effect of nanodroplet size on the wetting and contact angle of silver nanodroplet
on a copper solid surface was calculated by changing the number of atoms within the nanodroplet. By varying
the cooling rate during spreading of nanodroplet, it was found that decreasing the cooling rate decreases
the contact angle of nanodroplet, and it spreads better on the copper surface. Also, increasing initial
temperature of nanodroplet decreased the contact angle.
When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/35330 |
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